Chip packages including substrate integrated waveguides

A method for manufacturing a chip package, wherein the method comprises:

• generating a metal-dielectric arrangement, comprising a first metal layer, a second metal layer arranged over the first metal layer and a dielectric substrate arranged between the first metal layer and the second metal layer;
• forming a slot in the second metal layer;
• and
• providing an electrical coupling of the second metal layer and a semiconductor chip by a signal line, wherein the signal line crosses the slot when viewed in a direction perpendicular to the second metal layer, and wherein the signal line is configured to couple a signal into the metal-dielectric arrangement,
• wherein the metal-dielectric arrangement is configured to propagate the signal coupled into the metal-dielectric arrangement,
• wherein a frequency of the signal is greater than 1 GHz, and
• wherein the semiconductor chip comprises a monolithic microwave integrated circuit.