H10W 90/726

Between a chip and a stacked lead frame, conducting package substrate or

Official title: {between a chip and a stacked lead frame, conducting package substrate or heat sink}

H10W90/726 (Between a chip and a stacked lead frame, conducting package substrate or) appears on 2,039 US grants and 2,396 published applications in this corpus.

Search patents in H10W

Granted patents: 2,039
Published applications: 2,396
Assignees: 524
Inventors: 3,664
Latest grant: 22 Sep 2026

Filings by year

H10W 90/726: granted patents and published applications per publication year
Year	Granted patents	Published applications
1976	1	0
1977	0	0
1978	0	0
1979	0	0
1980	1	0
1981	0	0
1982	1	0
1983	1	0
1984	0	0
1985	0	0
1986	2	0
1987	2	0
1988	0	0
1989	1	0
1990	0	0
1991	0	0
1992	9	0
1993	4	0
1994	7	0
1995	6	0
1996	2	0
1997	9	0
1998	12	0
1999	14	0
2000	15	0
2001	19	10
2002	19	43
2003	37	40
2004	31	34
2005	44	79
2006	51	76
2007	47	94
2008	49	96
2009	46	73
2010	64	64
2011	76	73
2012	78	131
2013	99	121
2014	107	123
2015	126	159
2016	133	171
2017	179	144
2018	111	122
2019	115	105
2020	117	147
2021	83	99
2022	80	105
2023	81	71
2024	73	77
2025	59	81
2026	28	58

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

Recent patents

Most cited

By later US patents