Back to results
US 12,713,963 B2Granted
Lasing to attach die to lead frame
AssigneeTexas Instruments Incorporated
InventorsDaiki Komatsu, Kashyap Mohan
Life of this patent
Estimating the term…
Abstract
An example method includes placing a semiconductor die on a bonding surface of metal substrate. The die includes metal pillars extending from a surface of the die aligned with respective bonding locations on the bonding surface of the substrate. The pillars and the substrate can be formed of a common type of metal. The method also includes controlling a laser to emit laser light to heat the substrate at respective bonding locations to bond the metal pillars with the substrate at the respective bonding locations.
Claims24
A method comprising:
- placing a semiconductor die on a bonding surface of metal substrate, the die including metal pillars extending from a surface of the die aligned with respective bonding locations on the bonding surface of the substrate, the metal pillars and the substrate being formed of a common type of metal;
- and
- controlling a laser to emit laser light to heat the substrate at respective bonding locations to bond the metal pillars with the substrate at the respective bonding locations without solder or other interface material.
A method comprising:
- placing a semiconductor die on a bonding surface of metal substrate, the die including metal pillars extending from a surface of the die aligned with respective bonding locations on the bonding surface of the substrate, the metal pillars and the substrate being formed of a common type of metal;
- and
- controlling a laser to emit laser light to heat the substrate at respective bonding locations to form localized melt regions in the substrate at the respective bonding locations to bond the metal pillars with the substrate at the respective bonding locations.
A method comprising:
- placing a semiconductor die on a bonding surface of metal substrate, the die including metal pillars extending from a surface of the die aligned with respective bonding locations on the bonding surface of the substrate, the metal pillars and the substrate being formed of a common type of metal;
- and
- controlling a laser to emit laser light to heat the substrate at respective bonding locations to bond the metal pillars with the substrate at the respective bonding locations, wherein the laser includes an array of independently controllable laser diodes arranged along a surface of a bonding tool, the surface of the bonding tool configured to support a second surface of the substrate, which is opposite the bonding surface, during the placing and the controlling.
A method comprising:
- placing a semiconductor die on a bonding surface of metal substrate, the die including metal pillars extending from a surface of the die aligned with respective bonding locations on the bonding surface of the substrate, the metal pillars and the substrate being formed of a common type of metal;
- and
- heating the substrate at respective bonding locations to bond the metal pillars with the substrate at the respective bonding locations without solder or other interface material.
Dependencies are inferred from the claim text.