Laminate passive structure with stand-off for multilevel module integration

A communication device comprising:

• a control system;
• a baseband processor;
• receive circuitry;
• and
• transmit circuitry, wherein at least one or any combination of the control system, the baseband processer, the transmit circuitry, and the receive circuitry is implemented in a multi-level SIP module, which at least includes a module substrate, a laminate passive structure, and at least one top component, wherein:
• the laminate passive structure and the at least one top component are attached to a top side of the module substrate;
• the laminate passive structure includes a component unit and a plurality of copper posts;
• the component unit includes at least a laminate body, a top metal layer, and a bottom metal layer, wherein the bottom metal layer is positioned about a bottom side of the component unit and protrudes vertically from a bottom surface of the laminate body, while the top metal layer is positioned about a top side of the component unit and configured to provide at least a portion of a passive component;
• and
• the plurality of copper posts is connected to the bottom metal layer on the bottom side of the component unit and extends towards the top side of the module substrate, which provides a stand-off space that is vertically between the component unit and the module substrate.

A method of manufacturing a multi-level SIP module comprising:

• forming a laminate passive structure, which includes a component unit and a plurality of copper posts, wherein:
• the component unit includes at least a laminate body, a top metal layer, and a bottom metal layer, wherein the bottom metal layer is positioned about a bottom side of the component unit and protrudes vertically from a bottom surface of the laminate body, while the top metal layer is positioned about a top side of the component unit and configured to provide at least a portion of a passive component;
• and
• the plurality of copper posts is connected to the bottom metal layer on the bottom side of the component unit;
• attaching at least one top component to a top side of a module substrate;
• and
• attaching the laminate passive structure to the top side of the module substrate, wherein each of the plurality of copper posts extends from the bottom side of the component unit towards the top side of the module substrate, which provides a stand-off space that is vertically between the component unit and the module substrate.