H10P 14/6336
In the presence of a plasma [pecvd]
Official title: {in the presence of a plasma [PECVD]}
H10P14/6336 (In the presence of a plasma [pecvd]) appears on 5,861 US grants and 6,307 published applications in this corpus.
Search patents in H10P- Granted patents
- 5,861
- Published applications
- 6,307
- Assignees
- 804
- Inventors
- 9,068
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 7 | 0 |
| 1983 | 5 | 0 |
| 1984 | 4 | 0 |
| 1985 | 9 | 0 |
| 1986 | 12 | 0 |
| 1987 | 14 | 0 |
| 1988 | 11 | 0 |
| 1989 | 8 | 0 |
| 1990 | 9 | 0 |
| 1991 | 14 | 0 |
| 1992 | 17 | 0 |
| 1993 | 27 | 0 |
| 1994 | 32 | 0 |
| 1995 | 24 | 0 |
| 1996 | 31 | 0 |
| 1997 | 39 | 0 |
| 1998 | 58 | 0 |
| 1999 | 109 | 0 |
| 2000 | 155 | 0 |
| 2001 | 232 | 94 |
| 2002 | 228 | 213 |
| 2003 | 230 | 211 |
| 2004 | 213 | 246 |
| 2005 | 159 | 260 |
| 2006 | 184 | 271 |
| 2007 | 177 | 193 |
| 2008 | 139 | 192 |
| 2009 | 144 | 186 |
| 2010 | 145 | 163 |
| 2011 | 168 | 142 |
| 2012 | 127 | 147 |
| 2013 | 148 | 147 |
| 2014 | 127 | 189 |
| 2015 | 162 | 281 |
| 2016 | 255 | 297 |
| 2017 | 242 | 299 |
| 2018 | 245 | 298 |
| 2019 | 269 | 343 |
| 2020 | 278 | 383 |
| 2021 | 263 | 339 |
| 2022 | 239 | 370 |
| 2023 | 254 | 289 |
| 2024 | 255 | 306 |
| 2025 | 244 | 302 |
| 2026 | 142 | 146 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Methods and systems for topography-selective depositions29 Sep 2026US 12,751,229 B2ASM IP Holding B. V.
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Most cited
By later US patents
- Method for depositing an amorphous carbon layer1,124US 6,573,030 B1APPLIED Materials.Inc. · 2003
- Method of forming graded thin films using alternating pulses of vapor phase reactants1,034US 6,534,395 B2ASM Microchemistry Oy · 2003
- Sequencing of the recipe steps for the optimal low-k HDP-CVD processing882US 5,937,323 AAPPLIED Materials.Inc. · 1999
- Methods of forming thin films by atomic layer deposition842US 6,468,924 B2Samsung Electronics Co., Ltd. · 2002
- Sequencing of the recipe steps for the optimal low-dielectric constant HDP-CVD Processing817US 6,217,658 B1APPLIED Materials.Inc. · 2001