Method of forming protective film on outer circumferential portion including bevel portion of substrate

Abstract

An object is to improve the quality of a protective film provided to protect an outer circumferential portion of a substrate. There is provided a method of forming a protective film on an outer circumferential portion including a bevel portion of a substrate by using a plasma. The method comprises: placing the substrate having a first face and a second face that are opposed to each other, on a stage having smaller dimensions than dimensions of the substrate, such as to bring the second face of the substrate into contact with the stage and to cause the outer circumferential portion of the substrate to be protruded from an outer edge of the stage; causing at least part in a circumferential direction of the outer circumferential portion of the substrate to be opposed to an electrode; causing a first shielding structure that separates the outer circumferential portion of the substrate from an inner side area on an inner side of the outer circumferential portion of the substrate to come into contact with the first face of the substrate, and/or, causing a second shielding structure that separates the outer circumferential portion of the substrate from the inner side area of the substrate to come into contact with the second face of the substrate; and supplying a film-forming gas to between the outer circumferential portion of the substrate and the electrode, so as to form a protective film on the outer circumferential portion of the substrate.

Dependencies are inferred from the claim text.