A semiconductor manufacturing apparatus member used inside a chamber of a semiconductor manufacturing apparatus, the member comprising:
- a base material made of ceramic including
- a first surface,
- a second surface at a side opposite to the first surface, and
- at least one hole extending through the first and second surfaces;
- and
- of a different composition than the base material located on the base material,
- the at least one hole including
- a first hole part that is continuous with the first surface, the first hole part having an oblique surface oblique to a first direction, the first direction being from the first surface toward the second surface,
- a second hole part that is positioned between the second surface and the first hole part in the first direction and extends along the first direction, and
- a third hole part that is positioned between the first hole part and the second hole part in the first direction, the third hole part having an oblique surface oblique to the first direction,
- a plasma corrosion resistance of the ceramic layer being greater than a plasma corrosion resistance of the base material,
- the ceramic layer including
- a first part located on the first surface, the first part being exposed, and
- a second part located on the oblique surface of the first hole part,
- the oblique surface of the third hole part being exposed from an upper end of the oblique surface of the third hole part to a lower end of the oblique surface of the third hole part without the ceramic layer being provided on the second hole part and the third hole part,
- an upper end of the first hole part being continuous with the lower end of the oblique surface of the third hole part, the upper end of the first hole part being covered with the second part,
- the first hole part having a first end portion located at one end of the first hole part in the first direction, and a second end portion located at the other end of the first hole part in the first direction,
- the second hole part having a first end portion located at one end of the second hole part in the first direction, and a second end portion located at the other end of the second hole part in the first direction,
- the third hole part having a first end portion located at one end of the third hole part in the first direction, and a second end portion located at the other end of the third hole part in the first direction,
- the first end portion of the first hole part being continuous with the first surface,
- the second end portion of the second hole part being continuous with the second surface,
- the first end portion of the third hole part being continuous with the second end portion of the first hole part,
- the second end portion of the third hole part being continuous with the first end portion of the second hole part, and
- the at least one hole being configured to supply a raw material gas for plasma to the chamber.