Alkoxydisiloxanes and dense organosilica films made therefrom

A method for making a dense organosilica film, the method comprising:

• providing a substrate within a reaction chamber;
• introducing into the reaction chamber a gaseous composition comprising at least one alkoxydisiloxane compound having the structure given in Formula (I):
• wherein R1 is selected from a linear or branched C1 to C6 alkyl, and a cyclic C5 to C6 alkyl, R2 is selected from hydrogen, and a linear or branched C1 to C5 alkyl, R3-5 are selected independently from a linear or branched C1 to C5 alkyl, and R6 is selected from hydrogen and a linear or branched C1 to C5 alkyl;
• and
• applying energy to the gaseous composition comprising the at least one alkoxydisiloxane compound in the reaction chamber to induce reaction of the gaseous composition comprising the at least one alkoxydisiloxane compound and thereby deposit an organosilica film on the substrate,
• wherein the organosilica film has a dielectric constant of from ~2.50 to ~3.30 and an elastic modulus of from ~6 to ~35 GPa.