H05K 2203/14
Related to the order of processing steps
H05K2203/14 (Related to the order of processing steps) appears on 1,993 US grants and 2,232 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,993
- Published applications
- 2,232
- Assignees
- 784
- Inventors
- 4,291
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 5 | 0 |
| 1978 | 9 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 8 | 0 |
| 1982 | 9 | 0 |
| 1983 | 10 | 0 |
| 1984 | 9 | 0 |
| 1985 | 14 | 0 |
| 1986 | 14 | 0 |
| 1987 | 12 | 0 |
| 1988 | 20 | 0 |
| 1989 | 19 | 0 |
| 1990 | 22 | 0 |
| 1991 | 16 | 0 |
| 1992 | 22 | 0 |
| 1993 | 18 | 0 |
| 1994 | 18 | 0 |
| 1995 | 17 | 0 |
| 1996 | 21 | 0 |
| 1997 | 20 | 0 |
| 1998 | 29 | 0 |
| 1999 | 22 | 0 |
| 2000 | 32 | 0 |
| 2001 | 37 | 25 |
| 2002 | 51 | 84 |
| 2003 | 69 | 71 |
| 2004 | 63 | 117 |
| 2005 | 55 | 115 |
| 2006 | 72 | 127 |
| 2007 | 73 | 109 |
| 2008 | 53 | 106 |
| 2009 | 58 | 124 |
| 2010 | 64 | 117 |
| 2011 | 79 | 91 |
| 2012 | 107 | 98 |
| 2013 | 72 | 77 |
| 2014 | 83 | 131 |
| 2015 | 63 | 96 |
| 2016 | 93 | 86 |
| 2017 | 70 | 50 |
| 2018 | 61 | 52 |
| 2019 | 53 | 70 |
| 2020 | 61 | 73 |
| 2021 | 63 | 89 |
| 2022 | 59 | 56 |
| 2023 | 44 | 57 |
| 2024 | 47 | 59 |
| 2025 | 47 | 40 |
| 2026 | 16 | 112 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/1476Same or similar kind of process performed in phasesIndexing code983
- H05K 2203/1461Applying or finishing the circuit pattern after another processIndexing code616
- H05K 2203/1453Applying the circuit pattern before another processIndexing code177
- H05K 2203/1446Treatment after insertion of lead into holeIndexing code61
- H05K 2203/1438Treating holes after another processIndexing code54
- H05K 2203/1407Applying catalyst before applying plating resistIndexing code47
- H05K 2203/1492Periodical treatmentsIndexing code44
- H05K 2203/1415Applying catalyst after applying plating resistIndexing code33
Recent patents
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Circuit board and manufacturing method thereof4 Aug 2026US 12,701,654 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit-forming method and circuit-forming apparatus28 Jul 2026US 12,696,397 B2Fuji Corporation
- Method for manufacturing a printed circuit board with an embedded shield21 Jul 2026US 12,690,139 B2
- Method for manufacturing a multilayer circuit board14 Jul 2026US 12,684,698 B2Avary Holding (Shenzhen) Co., Limited.
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Composite electronic component6 Aug 2026US 2026/0231330 A1TDK Corporation
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Tamper-resistant wireless article including an antenna310US 6,421,013 B1Amerasia International Technology, Inc. · 2002
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008