Circuit-forming method and circuit-forming apparatus
AssigneeFuji Corporation
InventorKenji Tsukada
Life of this patent
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Abstract
A circuit-forming method includes a first forming step of forming a resin layer including a recessed portion by a first discharge device configured to discharge a curable resin, and a second forming step of forming an electrode inside the recessed portion by a second discharge device, which is configured to discharge a conductive paste, by referring to a first mark formed by the first discharge device. A circuit-forming apparatus includes a first discharge device configured to form a resin layer including a recessed portion by discharging a curable resin, and a second discharge device configured to form an electrode inside the recessed portion by discharging a conductive paste by referring to a first mark formed by the first discharge device.
Claims5
A circuit-forming method comprising:
- a first forming step of forming a resin layer on a pallet by a first discharge device configured to discharge a curable resin, the resin layer including a recessed portion;
- a step of forming a base on the pallet by discharging the curable resin by the first discharge device, flattening a surface of the curable resin by a flattening device, and then curing the curable resin, the base formed on the pallet adjacent to a corner of the resin layer;
- a step of forming a first mark by discharging the curable resin on the base by the first discharge device and curing the curable resin without flattening the surface of the curable resin by the flattening device;
- and
- a second forming step of forming an electrode inside the recessed portion by a second discharge device, which is configured to discharge a conductive paste, by referring to the first mark formed by the first discharge device.
Dependencies are inferred from the claim text.