H05K 2203/143
Treating holes before another process
Official title: Treating holes before another process, e.g. coating holes before coating the substrate
H05K2203/143 (Treating holes before another process) appears on 33 US grants and 134 published applications in this corpus.
Search patents in H05K- Granted patents
- 33
- Published applications
- 134
- Assignees
- 35
- Inventors
- 138
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 2 |
| 2003 | 2 | 2 |
| 2004 | 2 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 2 |
| 2016 | 2 | 4 |
| 2017 | 1 | 1 |
| 2018 | 6 | 4 |
| 2019 | 0 | 4 |
| 2020 | 1 | 1 |
| 2021 | 2 | 2 |
| 2022 | 1 | 1 |
| 2023 | 1 | 6 |
| 2024 | 2 | 4 |
| 2025 | 4 | 5 |
| 2026 | 2 | 94 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing a printed circuit board with an embedded shield21 Jul 2026US 12,690,139 B2
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Printed wiring board18 Nov 2025US 12,477,663 B2Ibiden Co., Ltd.
- Printed circuit board, fabrication method of the same and electronic device including the same9 Sep 2025US 12,414,230 B2Samsung Electronics Co., Ltd.
- Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same15 Apr 2025US 12,279,377 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
- Local-Bias Adaptive Drive for Timing Stabilization in Pipelined Mixed-Precision Processing Elements16 Jul 2026US 2026/0203017 A1
Most cited
By later US patents
- Method for making a printed wiring board113US 6,608,757 B1International Business Machines Corporation · 2003
- Advanced polymers on metal printed wiring board70US 4,963,697 ATexas Instruments Incorporated · 1990
- Printed wire circuit board and its method of manufacture64US 4,791,248 AThe Boeing Company · 1988
- Process for producing printed wiring boards62US 5,153,987 AHitachi Chemical Company, Ltd. · 1992
- Printed circuit board and printed circuit board base material26US 6,013,588 AO.K. Print Corporation · 2000