Method for making a printed wiring board

A process for making a printed wiring board (PWB) structure comprising the steps of:

• providing an electrically conductive power plane having a first plane side and a second plane side and one or more via holes formed and extending through said electrically conductive power plane from said first plane side to said second plane side;
• applying a photo-imageable dielectric (PID) material to said first and second plane sides of said electrically conductive power plane substantially filling said one or more via holes forming filled via holes;
• placing a photo-mask on said first plane side of said electrically conductive power plane,
• exposing said photo-mask on said first plane side of said electrically conductive power plane to light energy to substantially cure all of said PID material in said filled via holes,
• applying a developer to said electrically conductive power plane after said exposing step, said developer removing substantially all of said PID material that remains uncured after said exposing step;
• and
• laminating a first signal plane assembly to said first plane side of said electrically conductive power plane, said first signal plane assembly comprising a first electrically conductive signal plane and a first dielectric material layer having a uniform first thickness, wherein portions of said first dielectric material layer flow to fill areas of said one or more via holes not filled by said cured PID material.