Printed wire circuit board and its method of manufacture

A conductive core printed wire circuit board, comprising:

• (a) a printed wire circuit board having a conductive core and at least one oversized tnrough-hole extending through the core;
• (b) a dielectric collar in the through-hole, the collar being a cured, filled resin substantially free of voids, having a coefficient of thermal expansion closer to that of the core than the coefficient of thermal expansion of epoxy, and having a central bore drilled into the collar wherein the resin is m-diallyl phthalate;
• and
• (c) a conductive plating on the inner surface of the bore forming a plated-through-hole, the plating providing electrical connection between one side of the board and the other side but being electrically insulated from the core by the collar.

A conductive core printed wire circuit board, comprising:

• (a) a printed wire circuit board having a conductive core to remove heat and to control expansion, the core being selected from the group consisting of aluminum, graphite, or copper-Invar-copper, and having at least one oversized through-hole extending through the core from one side of the board to the otherside;
• (b) a dielectric collar adhered to the surface of the through-hole, the collar being a resin composite including fiberglass reinforcement, the resin having a use temperature higher than epoxy and curing temperature lower than polyimide, the resin also having a glass transition temperature in excess of about 200.degree. C. and a coefficient of thermal expansion lower than epoxy/glass and polyimide/glass, the filler having a central bore and being substantially free of voids;
• and
• (c) a conductive plating forming a plated-through-hole on the inner surface of the bore, the plating providing electrical connection between one side of the board to the other side but being electrically insulated from the core of the board by the filler.

A conductive core printed wire circuit board, comprising:

• (a) a conductive core;
• (b) a dielectric layer having a first surface in contact with at least a portion of the conductive core;
• and
• (c) a conductive plating on a second surface of the dielectric layer and being electrically isolated from the conductive core.
• wherein the dielectric layer is m-diallyl phthalate so that the layer and core have a smaller mismatch in coefficients of thermal expansion than the core would have with epoxy.