Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same

A method for manufacturing a conductive substrate with a filtering function, the comprising:

• (a) preparing a core layer, and forming at least one first conductive hole and at least one second conductive hole respectively penetrating through the core layer in a height direction in the core layer;
• (b) forming a sacrificial copper layer on an inner wall of the at least one first conductive hole and on a surface of the core layer, respectively, and forming a metal layer on the inner wall of the at least one second conductive hole;
• (c) forming the metal post in the at least one first conductive hole;
• (d) etching a part of the sacrificial copper layer on a lower surface of the core layer to expose a bottom end of the metal post, forming a lower insulating layer covering the bottom end of the metal post on the lower surface of the core layer, and forming a lower insulative post in the at least one second conductive hole;
• (e) etching a part of the sacrificial copper layer on an upper surface of the core layer and the sacrificial copper layer on the inner wall of the at least one first conductive hole, and forming a magnet wrapping around the metal post in an axial direction between the inner wall of the at least one first conductive hole and the metal post to obtain a first conductive post layer;
• (f) continuing to etch a part of the sacrificial copper layer on the upper surface of the core layer, forming an upper insulating layer covering a top end of the metal post on the upper surface of the core layer, and forming an upper insulative post in the at least one second conductive hole, the upper insulative post and the lower insulative post together forming an insulating column filling the second conductive hole to obtain a second conductive post layer;
• and
• (g) removing remaining sacrificial copper post layers on the upper surface and lower surface of the upper insulating layer, the lower insulating layer, and the core layer, and grinding ends of the first conductive post layer and the second conductive post layer respectively such that the end of the first conductive post layer and the end of the second conductive post layer are respectively flush with the core layer to obtain a conductive substrate with a filtering function.