H05K 2203/1476
Same or similar kind of process performed in phases
Official title: Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
H05K2203/1476 (Same or similar kind of process performed in phases) appears on 983 US grants and 1,092 published applications in this corpus.
Search patents in H05K- Granted patents
- 983
- Published applications
- 1,092
- Assignees
- 498
- Inventors
- 2,387
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 9 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 7 | 0 |
| 1991 | 8 | 0 |
| 1992 | 7 | 0 |
| 1993 | 6 | 0 |
| 1994 | 9 | 0 |
| 1995 | 9 | 0 |
| 1996 | 12 | 0 |
| 1997 | 12 | 0 |
| 1998 | 18 | 0 |
| 1999 | 8 | 0 |
| 2000 | 21 | 0 |
| 2001 | 19 | 7 |
| 2002 | 24 | 30 |
| 2003 | 31 | 31 |
| 2004 | 22 | 63 |
| 2005 | 30 | 72 |
| 2006 | 36 | 88 |
| 2007 | 51 | 84 |
| 2008 | 39 | 62 |
| 2009 | 39 | 68 |
| 2010 | 43 | 70 |
| 2011 | 48 | 46 |
| 2012 | 56 | 44 |
| 2013 | 37 | 38 |
| 2014 | 45 | 59 |
| 2015 | 26 | 41 |
| 2016 | 43 | 36 |
| 2017 | 32 | 24 |
| 2018 | 25 | 16 |
| 2019 | 21 | 31 |
| 2020 | 19 | 35 |
| 2021 | 30 | 40 |
| 2022 | 31 | 27 |
| 2023 | 25 | 28 |
| 2024 | 23 | 29 |
| 2025 | 22 | 15 |
| 2026 | 5 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Circuit board and manufacturing method thereof4 Aug 2026US 12,701,654 B2Samsung Electro-Mechanics Co., Ltd.
- Method, apparatus and system for processing a composite waste source26 May 2026US 12,637,737 B2NewSouth Innovations Pty Limited
- Printed circuit board assembly for an aircraft solid state power controller14 Apr 2026US 12,604,418 B2Hs Elektronik Systeme GmbH
- Opening method and opening device31 Mar 2026US 12,593,410 B2Shenzhen Han's Cnc Technology Co., Ltd.
- Pcb via design for power electronic applications and method for manufacturing30 Jul 2026US 2026/0223282 A1Mitsubishi Electric Corporation
- Precision alignment features for high density interconnects16 Jul 2026US 2026/0206605 A1Raytheon Company
- Method for applying a protective layer to a circuit-board assembly2 Jul 2026US 2026/0190247 A1Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg
- Roll-To-Roll Additive Manufacturing Method and Device11 Jun 2026US 2026/0164564 A1Trackonomy Systems, Inc.
- Methods for laser induced printing of electrodes with increased lifespan4 Jun 2026US 2026/0152859 A1Reophotonics, Ltd.
Most cited
By later US patents
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008
- Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components193US 4,067,104 ARockwell International Corporation · 1978
- Method of forming electrically conductive polymer interconnects on electrical substrates159US 5,611,140 AEpoxy Technology, Inc. · 1997