Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components

A method of providing at least one interconnector for microelectronic components, comprising the steps of:

• a. providing a microelectronic component having a surface with a coat of photoresist and at least one surface uncoated with photoresist;
• b. applying a deposit of metal on the uncoated surface;
• c. applying photoresist to the deposit of metal and to the coat of photoresist;
• d. removing the photoresist from the top surface of said deposit of metal;
• e. repeating steps (b), (c), and (d) until a predetermined height of deposited metal is reached;
• f. applying a top deposit of metal on the uncoated surface;
• g. smoothing said top deposit of metal and the surrounding photoresist as required to make their upper surfaces flush and free from surface irregularities, whereby at least one supported interconnect is provided on said microelectronic component.

A method of interconnecting two microelectronic components, comprising the steps of:

• a. providing a first microelectronic component having a surface with a coat of photoresist and at least one surface uncoated with photoresist;
• b. applying a deposit of metal on the uncoated surface;
• c. applying photoresist to the deposit of metal and to the coat of photoresist;
• d. removing the photoresist from the top surface of said deposit of metal;
• e. repeating steps (b), (c), and (d) until a predetermined height of deposited metal is reached;
• f. applying a top deposit of metal on the uncoated surface;
• g. applying a top coat of photoresist on said top deposit of metal and on the uppermost coat of photoresist;
• h. removing material from said top coating of photoresist and from said top deposit of metal until their upper surfaces are flush and free from surface irregularities;
• i. applying a final deposit of metal on the upper surface of said top deposit of metal;
• j. positioning a contact location on a second microelectronic component against said final deposit;
• and
• k. bonding said contact location of said second microelectronic to said final deposit.

A method of interconnecting a two-dimensional array of sensors, each sensor having an electrical output location, with signal processor means having a two-dimensional array of electrical input locations, comprising:

• a. applying photoresist to the surface of said processor means having said electrical input locations;
• b. removing photoresist from said array of electrical input locations;
• c. applying a deposit of metal on said electrical input locations;
• d. applying photoresist to the deposit of metal and to the applied photoresist;
• e. removing the photoresist from the top surface of said deposit of metal;
• f. applying a deposit of metal on the uncoated surface;
• g. repeating steps (d), (e), and (f), until a predetermined height of deposited metal is reached;
• h. applying a top coat of photoresist on the uppermost deposit of metal and applied photoresist;
• i. removing material from said top coat of photoresist and from said uppermost deposit of metal until their upper surfaces are flush and free from surface irregularities;
• j. applying a final deposit of metal on said uppermost deposit of metal;
• k. positioning said output locations on said sensors against said final deposit;
• and
• l. bonding said output locations of said sensors to said final deposit.