H05K 2203/1407
Applying catalyst before applying plating resist
H05K2203/1407 (Applying catalyst before applying plating resist) appears on 47 US grants and 26 published applications in this corpus.
Search patents in H05K- Granted patents
- 47
- Published applications
- 26
- Assignees
- 34
- Inventors
- 130
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 3 |
| 2003 | 5 | 3 |
| 2004 | 3 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 2 | 2 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 2 | 1 |
| 2019 | 0 | 4 |
| 2020 | 2 | 3 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 1 | 1 |
| 2024 | 2 | 1 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semi-additive process for catalytic printed circuit boards30 Dec 2025US 12,513,827 B2Catlam, LLC
- Catalyzed metal foil and uses thereof to produce electrical circuits13 Aug 2024US 12,063,748 B2Averatek Corporation
- Plated metallization structures2 Jan 2024US 11,862,518 B2Analog Devices International Unlimited Company
- Process for fabrication of a printed circuit board using a semi-additive process and removable backing foil25 Apr 2023US 11,638,354 B2Catlam, LLC
- Apparatus with a substrate provided with plasma treatment29 Mar 2022US 11,291,122 B2Intel Corporation
- Semi-Additive Process for Printed Circuit Boards11 Jun 2026US 2026/0164566 A1Catlam, LLC
- Catalyzed Metal Foil and Uses Thereof5 Dec 2024US 2024/0407106 A1Averatek Corporation
- Semi-Additive Process for Printed Circuit Boards3 Aug 2023US 2023/0247774 A1Catlam, LLC
- Catalyzed metal foil and uses thereof19 Aug 2021US 2021/0259112 A1Averatek Corporation
- Semi-Additive Process for Printed Circuit Boards10 Dec 2020US 2020/0389983 A1Catlam, LLC
Most cited
By later US patents
- Method for patterned metallization of a substrate surface75US 5,576,073 ALPKF CAD/CAM Systeme GmbH · 1996
- Method for manufacture of multilayer circuit board61US 4,902,610 AShipley Company, L.L.C. · 1990
- Method for manufacture of multilayer circuit board56US 5,246,817 AShipley Company, L.L.C. · 1993
- Method for selective electroless plating of copper onto a non-conductive substrate surface55US 4,448,804 AInternational Business Machines Corporation · 1984
- Process for producing electrical circuits with precision surface features43US 5,284,548 AMicroelectronics and Computer Technology Corporation · 1994