H05K 2203/1415
Applying catalyst after applying plating resist
H05K2203/1415 (Applying catalyst after applying plating resist) appears on 33 US grants and 9 published applications in this corpus.
Search patents in H05K- Granted patents
- 33
- Published applications
- 9
- Assignees
- 23
- Inventors
- 76
- Latest grant
- 13 Aug 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 2 | 2 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Catalyzed metal foil and uses thereof to produce electrical circuits13 Aug 2024US 12,063,748 B2Averatek Corporation
- Method for preparing a patterned electric circuit7 Apr 2015US 9,000,303 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Method of fabricating a solder pad structure8 Nov 2011US 8,051,560 B2Unimicron Technology Corp.
- Transparent electrically conductive film and process for producing the same8 Feb 2011US 7,883,837 B2Seiren Co., Ltd.
- Laser enhanced plating for forming wiring patterns6 Nov 2007US 7,291,380 B2Hewlett-Packard Development Company, L. P.
- Component carrier, method for manufacturing a component carrier and a package comprising a component carrier2 Oct 2025US 2025/0309013 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Catalyzed Metal Foil and Uses Thereof5 Dec 2024US 2024/0407106 A1Averatek Corporation
- Catalyzed metal foil and uses thereof19 Aug 2021US 2021/0259112 A1Averatek Corporation
- Single lamination blind and method for forming the same9 May 2019US 2019/0141840 A1R&D Circuits, Inc.
- Method of Using a Mask to Provide a Patterned Substrate21 Mar 2013US 2013/0068723 A1
Most cited
By later US patents
- Printed circuit board having an injection molded substrate127US 4,996,391 ASiemens Aktiengesellschaft · 1991
- Electroless deposition employing laser-patterned masking layer90US 4,865,873 AGeneral Electric Company · 1989
- Preparation of photoformed plastic multistrate by via formation first41US 4,572,764 AE. I. Du Pont de Nemours and Company · 1986
- Selective metallization process39US 5,158,860 AShipley Company, L.L.C. · 1992
- Process for producing printed wiring board38US 5,309,632 AHitachi Chemical Company, Ltd. · 1994