Method for preparing a patterned electric circuit

A method for preparing a pattern for an electric circuit comprising the steps of:

• (a) providing a substrate, which substrate comprises a first metal or alloy thereof;
• (b) providing a pattern of an inhibiting material for an electrical circuit onto said substrate by
• i) applying a layer of the inhibiting material onto said substrate and mechanically removing locally the layer of the inhibiting material, thereby exposing at least part of the first metal or alloy thereof present in the substrate;
• or
• ii) applying a layer of the inhibiting material onto said substrate, wherein said layer has pre-determined pattern which incompletely covers said substrate, thereby exposing at least part of the first metal or alloy thereof present in the substrate;
• wherein the inhibiting material comprises a material selected from the group consisting of heavy metal ions, organic and inorganic sulphur, selenium or tellur containing compounds, dipyridyl and maleic acid;
• (c) depositing by means of an electroless process a layer of a second metal or alloy thereof on the exposed part of the first metal or alloy thereof present in the substrate as obtained in step (b), whereby the inhibiting material that is still present on the substrate after step (b) locally inhibits the second metal or alloy thereof to be deposited on the first metal or alloy thereof, ensuring that the second metal or alloy thereof will selectively be deposited on the exposed part of the first metal or alloy thereof as obtained in step (b).

A method for preparing a pattern for an electric circuit comprising the steps of:

• (a) providing a substrate having an outer skin part and an internal part, of which the skin part is more hydrophobic than the internal part of the substrate;
• (b) removing mechanically, thermally or laser-induced locally the skin part to obtain a pattern for an electric circuit, thereby exposing at least part of the internal part of the substrate;
• (c) establishing a discontinuous distribution of particles of a first metal or alloy thereof on the exposed part of the internal part of the substrate as obtained in step (b);
• and
• (d) depositing by means of an electroless process a layer of a second metal or alloy thereof on the particles of the first metal or alloy thereof that are distributed on the pattern in step (c);
• wherein in step (c) the establishing of a distribution of particles of a first metal or alloy thereof comprises adsorption of nanoparticles from a solution.