Back to results
US 7,291,380 B2Granted
Laser enhanced plating for forming wiring patterns
AssigneeHewlett-Packard Development Company, L.P.
InventorsPeter S. Nyholm, Curt Lee Nelson, Niranjan Thirukkovalur, Paul McClelland
Life of this patent
Estimating the term…
Abstract
A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region.
Claims8
A microelectronic device comprising:
- a substrate with a surface;
- a plating enhancing layer having a roughened region, said plating enhancing layer applied to the surface of the substrate, wherein the plating enhancing layer includes a sacrificial layer and a non-wetting layer, wherein the non-wetting layer includes at least one of a fluoropolymer, a poly(para-xylylene), Parylene, or a non-wetting polymer, and combinations thereof;
- a seed layer supported by the laser-roughened region;
- and
- a plating layer supported by the seed layer.
2 more elements
A method comprising:
- applying a plating enhancing layer to a surface of a substantially non-plateable substrate;
- laser-treating a region of the plating enhancing layer, the plating enhancing layer having a roughened region, wherein the plating enhancing layer includes a sacrificial layer and a non-wetting layer, wherein the non-wetting layer includes at least one of a fluoropolymer, a poly(para-xylylene), or a non-wetting polymer, and combinations thereof;
- forming a seed layer in the laser-treated region, the seed layer supported by the laser roughened region;
- and
- forming a plating layer over the seed layer, the plating layer supported by the seed layer.
2 more elements
Dependencies are inferred from the claim text.