US 2026/0231330 A1 · COMPOSITE ELECTRONIC COMPONENT

Abstract

To improve, in a composite electronic component having a structure in which an electronic component is embedded in an insulating layer, the reliability of a conductor pattern using an insulating film provided on the outermost surface of the composite electronic component. A composite electronic component includes an insulating layer in which an ESD protection component is embedded; a wiring structure stacked on the insulating layer; and a solder resist covering a surface of the wiring structure. The solder resist covers an outer peripheral area, which is a part of the upper surface of the conductor pattern other than an area, on the upper surface of a conductor pattern and is filled in a clearance formed between an outer peripheral area defined on the lower surface of the conductor pattern and the surface.

Claims6

Dependent claims

A composite electronic component comprising:

a first insulating layer;
an electronic component embedded in the first insulating layer;
a wiring structure having first and second surfaces positioned opposite to each other and stacked on the first insulating layer suc
h that the first surface and the first insulating layer face each other;
and
a second insulating layer covering the second surface,
wherein the wiring structure has a conductor pattern provided on the second surface, and
wherein the second insulating layer covers an outer peripheral area of the conductor pattern, excluding part of an upper surface of the conductor pattern and is filled in a clearance formed between an outer peripheral area defined on a lower surface of the conductor pattern and the second surface.

5 more elements

Dependencies are inferred from the claim text.

Composite electronic component

Life of this patent

Composite electronic component

Life of this patent

Abstract

Claims6