H05K 2203/1438
Treating holes after another process
Official title: Treating holes after another process, e.g. coating holes after coating the substrate
H05K2203/1438 (Treating holes after another process) appears on 54 US grants and 36 published applications in this corpus.
Search patents in H05K- Granted patents
- 54
- Published applications
- 36
- Assignees
- 40
- Inventors
- 140
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 5 | 1 |
| 2003 | 2 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 2 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 2 |
| 2017 | 1 | 0 |
| 2018 | 1 | 4 |
| 2019 | 2 | 2 |
| 2020 | 2 | 4 |
| 2021 | 2 | 3 |
| 2022 | 2 | 1 |
| 2023 | 1 | 3 |
| 2024 | 2 | 4 |
| 2025 | 3 | 4 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit-forming method and circuit-forming apparatus28 Jul 2026US 12,696,397 B2Fuji Corporation
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Semiconductor package device and method of manufacturing the same27 Jan 2026US 12,538,419 B2Advanced Semiconductor Engineering, Inc.
- Printed wiring board18 Nov 2025US 12,477,663 B2Ibiden Co., Ltd.
- Printed wiring board9 Sep 2025US 12,414,231 B2Ibiden Co., Ltd.
- Precision alignment features for high density interconnects16 Jul 2026US 2026/0206605 A1Raytheon Company
- Semiconductor package device and method of manufacturing the same9 Apr 2026US 2026/0101436 A1Advanced Semiconductor Engineering, Inc.
- Printed wiring board4 Dec 2025US 2025/0374425 A1Ibiden Co., Ltd.
- Transfer laminate and manufacturing method therefor27 Nov 2025US 2025/0365870 A1DIC Corporation
- Component Carrier and Method for Manufacturing a Component Carrier25 Sep 2025US 2025/0301575 A1AT&S (Chongqing) Company Limited
Most cited
By later US patents
- Multilayer printed circuit board and method for fabricating same109US 5,451,721 AInternational Business Machines Corporation · 1995
- Lamination method for coating the sidewall or filling a cavity in a substrate107US 5,208,068 AInternational Business Machines Corporation · 1993
- Integrated circuit packaging using flexible substrate87US 5,065,227 AInternational Business Machines Corporation · 1991
- Printed circuit board82US 7,459,202 B2Motorola, Inc. · 2008
- Printed circuit board61US 4,221,925 AWestern Electric Company, Inc. · 1980