H05K 2203/1484
Simultaneous treatments
Official title: Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components
H05K2203/1484 (Simultaneous treatments) appears on 24 US grants and 25 published applications in this corpus.
Search patents in H05K- Granted patents
- 24
- Published applications
- 25
- Assignees
- 24
- Inventors
- 86
- Latest grant
- 1 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 1 | 3 |
| 2016 | 0 | 2 |
| 2017 | 3 | 0 |
| 2018 | 1 | 0 |
| 2019 | 1 | 4 |
| 2020 | 1 | 2 |
| 2021 | 3 | 3 |
| 2022 | 0 | 2 |
| 2023 | 2 | 2 |
| 2024 | 1 | 1 |
| 2025 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Manufacture of a curved electronic device using differential heating and curved electronic device1 Jul 2025US 12,349,272 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- High current surface mount toroid inductor18 Mar 2025US 12,255,002 B2Steering Solutions IP Holding Corporation
- Manufacturing method for double-sided wiring circuit board and double-sided wiring circuit board8 Oct 2024US 12,114,438 B2Nitto Denko Corporation
- Additive manufactured 3D electronic substrate19 Sep 2023US 11,765,839 B2Schlumberger Technology Corporation
- Manufacturing apparatus for display device and method of using the same31 Jan 2023US 11,570,907 B2Samsung Display Co., Ltd.
- Systems and methods for additive manufacturing of electronics16 May 2024US 2024/0164016 A1
- Plating method and method of manufacturing printed circuit board29 Jun 2023US 2023/0209721 A1Nitto Denko Corporation
- Manufacturing method for double-sided wiring circuit board and double- sided wiring circuit board12 Jan 2023US 2023/0008736 A1Nitto Denko Corporation
- High current surface mount toroid inductor26 May 2022US 2022/0165471 A1Steering Solutions IP Holding Corporation
- Manufacture of a curved electronic device using differential heating and curved electronic device13 Jan 2022US 2022/0015229 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
Most cited
By later US patents
- Method of mounting interrelated components150US 4,371,912 AMotorola, Inc. · 1983
- Single step solder process77US 4,761,881 AInternational Business Machines Corporation · 1988
- Method of soldering components to printed circuit boards56US 5,111,991 AMotorola, Inc. · 1992
- Method for manufacturing an electronic part36US 4,850,103 AMatsushita Electric Industrial Co., Ltd. · 1989
- Method for soldering two kinds of parts on one-side printed board7US 5,070,604 ASony Corporation · 1991