High current surface mount toroid inductor

A circuit card assembly comprising:

• a substrate having a first surface and a second surface;
• at least one component, located on said second surface and opposite of said inductor, operatively coupled to said second surface of said substrate;
• and
• an inductor operatively coupled to said first surface of said substrate, opposite said at least one component, without penetrating said substrate.

A method for manufacturing a circuit card assembly, the method comprising:

• providing a substrate, the substrate having a first surface and a second surface, the first surface and the second surface being opposite and spaced from one another;
• populating at least one component onto the second surface of the substrate to form a circuit card assembly;
• populating an inductor onto the first surface of the substrate of the circuit card assembly, opposite of the at least one component, without penetrating the substrate;
• and
• curing the circuit card assembly including the inductor.