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AssigneeSony Corporation
InventorsMitsuyuki Banba, Hideki Matsuo, Yasuo Nakayama, Hideo Suzuki
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The present invention relates to a method for soldering two kinds of parts, parts with leads and chip parts, on one-side printed board, comprising coating a cream solder on a plurality of points of a wiring pattern surface of one-side printed board and coating an adhesive for adhering parts with leads on a non-wiring pattern, adhering parts with leads to said non-wiring pattern surface by said adhesive, passing leads of the parts with leads through lead insert holes of said one-side printed board to insert the same into one cream solder on the wiring pattern surface from the side of the non-wiring pattern surface, mounting chip parts on the other cream solder on said wiring pattern surface, thereafter heating at once the whole cream solder on the wiring pattern to simultaneously reflow-solder the parts with leads and chip parts whereby the parts with leads and the chip parts can be simultaneously soldered by a single reflow soldering step.
A method for soldering two kinds of parts, parts with leads and chip parts, on a circuit board of the type having a wiring pattern printed on a first side of the circuit board and no printed wiring pattern on the opposite, second side of the circuit board, comprising the steps of:
Dependencies are inferred from the claim text.