H05K 2203/1423
Applying catalyst before etching
Official title: Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit
H05K2203/1423 (Applying catalyst before etching) appears on 14 US grants and 14 published applications in this corpus.
Search patents in H05K- Granted patents
- 14
- Published applications
- 14
- Assignees
- 11
- Inventors
- 35
- Latest grant
- 27 Feb 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 2 |
| 2019 | 1 | 4 |
| 2020 | 3 | 5 |
| 2021 | 1 | 0 |
| 2022 | 2 | 1 |
| 2023 | 0 | 0 |
| 2024 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
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- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor12 May 2022US 2022/0151081 A1Richview Electronics Co., Ltd.
- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor29 Oct 2020US 2020/0344895 A1Richview Electronics Co., Ltd.
- Plated metallization structures15 Oct 2020US 2020/0328114 A1Analog Devices Global Unlimited Company
- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor15 Oct 2020US 2020/0329567 A1Richview Electronics Co., Ltd.
- Apparatus with a substrate provided with plasma treatment30 Jul 2020US 2020/0245472 A1Intel Corporation
Most cited
By later US patents
- Method for forming electric circuits on a base board26US 4,735,676 AAsahi Chemical Research Laboratory Co., Ltd. · 1988
- Method for manufacture of printed circuit boards11US 5,358,602 AEnthone-OMI, Inc. · 1994
- Method for producing a plated-through hole on a printed-circuit board7US 5,799,393 ABlaupunkt-Werke GmbH · 1998
- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor4US 10,321,581 B2Richview Electronics Co., Ltd. · 2019
- Plated metallization structures3US 10,699,948 B2Analog Devices Global Unlimited Company · 2020