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US 5,358,602 AGranted
Method for manufacture of printed circuit boards
AssigneeEnthone-OMI, Inc.
InventorsGary R. Sutcliffe, Jay B. Conrod
Life of this patent
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Abstract
A method for the manufacture of printed circuit boards is provided comprising conditioning the board, activating with a catalytic metal, post-activating, stabilizing and etching the copper surfaces before the desired circuit is formed on the board. This process eliminates the need for a flash coating of copper in the through holes before the use of protective coatings such as imaging resists and soldermasks.
Claims14
A method for making printed circuit boards comprising:
- a. contacting the board with a conditioner to clean the board surface;
- b. contacting the conditioned board with a metal containing activator to activate the board surface for plating;
- c. treating the activated board with a post-activator;
- d. treating the resulting board with a stabilizer;
- e. treating the stabilized surface with an etchant to etch the board surface;
- f. forming the desired circuit pattern on the board;
- g. plating the board to the desired thickness.
4 more elements
Dependencies are inferred from the claim text.