H05K 2203/1492
Periodical treatments
Official title: Periodical treatments, e.g. pulse plating of through-holes
H05K2203/1492 (Periodical treatments) appears on 44 US grants and 66 published applications in this corpus.
Search patents in H05K- Granted patents
- 44
- Published applications
- 66
- Assignees
- 35
- Inventors
- 150
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 3 |
| 2003 | 2 | 7 |
| 2004 | 3 | 5 |
| 2005 | 3 | 2 |
| 2006 | 0 | 3 |
| 2007 | 2 | 5 |
| 2008 | 0 | 2 |
| 2009 | 0 | 7 |
| 2010 | 2 | 2 |
| 2011 | 2 | 1 |
| 2012 | 3 | 4 |
| 2013 | 4 | 0 |
| 2014 | 2 | 2 |
| 2015 | 2 | 4 |
| 2016 | 3 | 4 |
| 2017 | 1 | 1 |
| 2018 | 2 | 0 |
| 2019 | 0 | 0 |
| 2020 | 2 | 2 |
| 2021 | 1 | 3 |
| 2022 | 0 | 3 |
| 2023 | 1 | 2 |
| 2024 | 1 | 3 |
| 2025 | 3 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Single step electrolytic method of filling through-holes in printed circuit boards and other substrates19 May 2026US 12,635,082 B2MacDermid Enthone Inc.
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper7 Oct 2025US 12,439,528 B2Atotech Deutschland GmbH
- Complex waveform for electrolytic plating10 Jun 2025US 12,325,927 B2MacDermid Enthone Inc.
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper4 Mar 2025US 12,245,383 B2Atotech Deutschland GmbH
- Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board13 Aug 2024US 12,063,751 B2Atotech Deutschland GmbH
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper10 Oct 2024US 2024/0341042 A1Atotech Deutschland GmbH
- Complex waveform for electrolytic plating15 Aug 2024US 2024/0271307 A1MacDermid Enthone Inc.
- Single Step Electrolytic Method of Filling Through-Holes in Printed Circuit Boards and Other Substrates4 Jul 2024US 2024/0224432 A1MacDermid Enthone Inc.
- Method of filling through-holes to reduce voids7 Sep 2023US 2023/0279577 A1
- Hybrid process for pcb production by lad system27 Jul 2023US 2023/0240022 A1IO Tech Group Ltd.
Most cited
By later US patents
- Implantation of electrical feed-through conductors67US 4,368,106 AGeneral Electric Company · 1983
- Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes45US 6,309,528 B1Faraday Technology Marketing Group, LLC · 2001
- Printed wiring board and its manufacturing method41US 7,691,189 B2Ibiden Co., Ltd. · 2010
- Periodic reverse current pulsing to form uniformly sized feed through conductors27US 4,396,467 AGeneral Electric Company · 1983
- Printed wiring board and its manufacturing method27US 7,230,188 B1Ibiden Co., Ltd. · 2007