Printed wiring board and its manufacturing method
AssigneeIbiden Co., Ltd.
InventorsHonchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda
Life of this patent
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Abstract
The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.
Claims18
An electroless plating solution which comprises an aqueous solution containing 0.025 to 0.25 mol/L of a basic compound, 0.03 to 0.15 mol/L of a reducing agent, 0.02 to 0.06 mol/L of copper ion, 0.05 to 0.3 mol/L of tartaric acid or a salt thereof and nickel ion formed from at least one of nickel chloride and nickel sulfate,
- wherein
- said reducing agent comprises at least one selected from the group consisting of formaldehyde and hydrazine.
An electroless plating solution which comprises an aqueous solution containing a basic compound, a reducing agent, copper ion, tartaric acid or a salt thereof and 0.01 to 0.05 weight % of at least one metal ion species selected from the group consisting of nickel ion, cobalt ion and iron ion,
- wherein
- said reducing agent comprises at least one selected from the group consisting of formaldehyde and hydrazine, and
- said nickel ion is formed from at least one of nickel chloride and nickel sulfate.
Dependencies are inferred from the claim text.