Printed wiring board and its manufacturing method

A printed circuit board comprising a substrate and, built thereon, a circuit comprised of a copper film,

• wherein said copper film comprises an electroplated layer and has properties that (a) its crystallinity is such that the X-ray diffraction half-width of the (331) plane of copper is less than 0.3 deg. and (b) the variation in thickness ((maximum thickness-minimum thickness)/average thickness) of said copper film as measured over the whole surface of said substrate is not greater than 0.4.

A printed circuit board comprising a substrate formed with a conductor circuit, an interlayer resin insulating layer thereon and a conductor circuit comprised of a copper film on said interlayer resin insulating layer and having via holes by which said conductor circuits are interconnected,

• wherein said copper film comprises an electroplated layer and has properties that (a) its crystallinity is such that the X-ray diffraction half-width of the (331) plane of copper is less than 0.3 deg. and (b) the variation in thickness ((maximum thickness-minimum thickness)/average thickness) of said copper film as measured over the whole surface of said substrate is not greater than 0.4.

A printed circuit board comprising a resin insulating substrate board formed with a roughened surface and, built thereon by semi-additive process, a conductor circuit comprising an electroless plated film and an electroplated film,

• wherein said roughened surface comprises convex areas and concave areas, and said electroless plated film is complementary to a surface of said roughened surface with said electroless plated film in convex areas of said roughened surface being relatively greater in thickness than said electroless plated film in concave areas of said roughened surface.