H05K 2203/1446
Treatment after insertion of lead into hole
Official title: Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
H05K2203/1446 (Treatment after insertion of lead into hole) appears on 61 US grants and 46 published applications in this corpus.
Search patents in H05K- Granted patents
- 61
- Published applications
- 46
- Assignees
- 42
- Inventors
- 113
- Latest grant
- 15 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 3 |
| 2004 | 0 | 3 |
| 2005 | 1 | 3 |
| 2006 | 4 | 1 |
| 2007 | 2 | 4 |
| 2008 | 1 | 4 |
| 2009 | 3 | 2 |
| 2010 | 5 | 3 |
| 2011 | 2 | 3 |
| 2012 | 8 | 5 |
| 2013 | 0 | 1 |
| 2014 | 3 | 0 |
| 2015 | 0 | 1 |
| 2016 | 2 | 4 |
| 2017 | 2 | 2 |
| 2018 | 1 | 1 |
| 2019 | 1 | 0 |
| 2020 | 1 | 0 |
| 2021 | 1 | 3 |
| 2022 | 2 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
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Most cited
By later US patents
- Biocompatible bonding method and electronics package suitable for implantation80US 7,211,103 B2Second Sight Medical Products, Inc. · 2007
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- Method of using frozen epoxy for placing pin-mounted components in a circuit module43US 5,255,431 AGeneral Electric Company · 1993