Electronics package suitable form implantation
AssigneeSecond Sight Medical Products, Inc.
InventorsRobert J. Greenberg, Jerry Ok
Life of this patent
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Abstract
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
Claims10
An implantable electronic device, comprising:
- a) a substrate having one or more contacts and two or more layers of conductive adhesive on said contacts;
- b) a flexible assembly having one or more bond pads and one or more layers of conductive adhesive on said bond pads;
- c) said conductive adhesive connecting said contacts on said substrate with said bond pads on said flexible assembly;
- and
- d) adhesive underfill in the remaining space between said substrate and said flexible assembly.
Dependencies are inferred from the claim text.