Biocompatible bonding method and electronics package suitable for implantation

An implantable device comprising:

• a substrate containing at least one electrically conductive feedtbrough attached to an electrically conductive routing on at least one side of said substrate;
• a flexible assembly comprised of a first flexible electrically insulating substrate, a second flexible electrically insulating substrate, and at least one bond pad between said first and said second flexible electrically insulating substrates;
• said first flexible electrically insulating substrate defining at least one hole that passes through said first flexible electrically insulating substrate, wherein said hole is aligned with said routing;
• said second flexible electrically insulating substrate defining at least one hole that passes through said first flexible electrically insulating substrate, wherein said hole is aligned with said routing;
• said at least one bond pad defining a hole therethrough, wherein said hole is aligned with said routing;
• and
• wherein said substrate and said flexible assembly are bonded together with a deposited rivet.