H05K 2203/1461
Applying or finishing the circuit pattern after another process
Official title: Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
H05K2203/1461 (Applying or finishing the circuit pattern after another process) appears on 616 US grants and 755 published applications in this corpus.
Search patents in H05K- Granted patents
- 616
- Published applications
- 755
- Assignees
- 258
- Inventors
- 1,248
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 9 | 0 |
| 2000 | 5 | 0 |
| 2001 | 14 | 15 |
| 2002 | 12 | 36 |
| 2003 | 22 | 23 |
| 2004 | 31 | 37 |
| 2005 | 21 | 33 |
| 2006 | 26 | 24 |
| 2007 | 15 | 16 |
| 2008 | 8 | 29 |
| 2009 | 12 | 43 |
| 2010 | 13 | 38 |
| 2011 | 20 | 32 |
| 2012 | 38 | 44 |
| 2013 | 29 | 34 |
| 2014 | 33 | 64 |
| 2015 | 32 | 44 |
| 2016 | 40 | 35 |
| 2017 | 26 | 21 |
| 2018 | 26 | 26 |
| 2019 | 25 | 29 |
| 2020 | 30 | 28 |
| 2021 | 22 | 28 |
| 2022 | 19 | 20 |
| 2023 | 14 | 17 |
| 2024 | 15 | 18 |
| 2025 | 16 | 13 |
| 2026 | 5 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for manufacturing a multilayer circuit board14 Jul 2026US 12,684,698 B2Avary Holding (Shenzhen) Co., Limited.
- Method for manufacturing substrate with built-in components, and substrate with built-in components26 May 2026US 12,641,728 B2Resonac Corporation
- Method for manufacturing a multilayer circuit board26 May 2026US 12,641,732 B2Avary Holding (Shenzhen) Co., Limited.
- Display device using micro LED and modular display device using same31 Mar 2026US 12,593,551 B2LG Electronics Inc.
- Producing method of wired circuit board27 Jan 2026US 12,538,431 B2Nitto Denko Corporation
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Composite electronic component6 Aug 2026US 2026/0231330 A1TDK Corporation
- Multilayer circuit board with embedded module30 Jul 2026US 2026/0223296 A1Avary Holding (Shenzhen) Co., Limited.
- Component Carrier With Reinforcing Portion, and Manufacturing Method16 Jul 2026US 2026/0206142 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Offset-chip embedded circuit board and manufacturing method therefor11 Jun 2026US 2026/0165169 A1ZF Friedrichshafen AG
Most cited
By later US patents
- Porous substrate and conductive ink filled vias for printed circuits181US 5,346,750 AMatsushita Electric Industrial Co., Ltd. · 1994
- Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same153US 5,484,647 AMatsushita Electric Industrial Co., Ltd. · 1996
- Method of manufacturing organic substrate used for printed circuits112US 5,481,795 AMatsushita Electric Industrial Co., Ltd. · 1996
- Wiring board109US 6,207,259 B1KYOCERA Corporation · 2001
- Method of making a through-hole connector92US 4,383,363 ASharp Kabushiki Kaisha · 1983