Producing method of wired circuit board
AssigneeNitto Denko Corporation
InventorsHayato Takakura, Yasunari Oyabu, Naoki Shibata
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Abstract
Provided is a method for producing a wired circuit board in which a first preparation step of preparing a first substrate having an insulating layer and a conductive layer disposed on one surface of the insulating layer; a second preparation step of preparing a second substrate having a metal layer; a bonding step of laminating the first substrate and the second substrate so that the conductive layer and the metal layer are in contact with each other, and metal-bonding the conductive layer and the metal layer; and a patterning step of forming a conductive pattern on the other surface of the insulating layer are carried out.
Claims16
A method for producing a wired circuit board, comprising:
- a first preparation step of preparing a first substrate having an insulating layer and a conductive layer disposed on one surface of the insulating layer;
- a second preparation step of preparing a second substrate having a metal layer;
- a bonding step of laminating the first substrate and the second substrate so that the conductive layer and the metal layer are in contact with each other, and metal-bonding the conductive layer and the metal layer;
- a patterning step of forming a conductive pattern on the other surface of the insulating layer;
- and
- an etching step of etching the conductive layer and the metal layer that are bonded in the bonding step,
- wherein the patterning step is carried out after the bonding step, or the bonding step is carried out after the patterning step.
A method for producing a wired circuit board, comprising:
- a first preparation step of preparing a first substrate having an insulating layer and a conductive layer disposed on one surface of the insulating layer;
- a first etching step of etching the conductive layer;
- a second preparation step of preparing a second substrate having a metal layer;
- a second etching step of etching the metal layer;
- a bonding step of laminating the first substrate and the second substrate so that the conductive layer and the metal layer are in contact with each other, and metal-bonding the conductive layer and the metal layer after the first etching step and the second etching step;
- and
- a patterning step of forming a conductive pattern on the other surface of the insulating layer,
- wherein the patterning step is carried out after the bonding step, or the bonding step is carried out after the patterning step.
Dependencies are inferred from the claim text.