H05K 2203/1469
Circuit made after mounting or encapsulation of the components
H05K2203/1469 (Circuit made after mounting or encapsulation of the components) appears on 337 US grants and 471 published applications in this corpus.
Search patents in H05K- Granted patents
- 337
- Published applications
- 471
- Assignees
- 160
- Inventors
- 756
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 2 |
| 2002 | 3 | 5 |
| 2003 | 3 | 3 |
| 2004 | 6 | 6 |
| 2005 | 3 | 14 |
| 2006 | 2 | 11 |
| 2007 | 5 | 8 |
| 2008 | 4 | 18 |
| 2009 | 6 | 33 |
| 2010 | 8 | 30 |
| 2011 | 11 | 28 |
| 2012 | 32 | 37 |
| 2013 | 25 | 25 |
| 2014 | 28 | 48 |
| 2015 | 25 | 28 |
| 2016 | 24 | 25 |
| 2017 | 15 | 13 |
| 2018 | 19 | 17 |
| 2019 | 16 | 17 |
| 2020 | 23 | 22 |
| 2021 | 17 | 23 |
| 2022 | 14 | 13 |
| 2023 | 10 | 13 |
| 2024 | 11 | 13 |
| 2025 | 14 | 11 |
| 2026 | 4 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing a multilayer circuit board14 Jul 2026US 12,684,698 B2Avary Holding (Shenzhen) Co., Limited.
- Method for manufacturing substrate with built-in components, and substrate with built-in components26 May 2026US 12,641,728 B2Resonac Corporation
- Method for manufacturing a multilayer circuit board26 May 2026US 12,641,732 B2Avary Holding (Shenzhen) Co., Limited.
- Display device using micro LED and modular display device using same31 Mar 2026US 12,593,551 B2LG Electronics Inc.
- Method for embedding a component in a printed circuit board16 Dec 2025US 12,501,551 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Composite electronic component6 Aug 2026US 2026/0231330 A1TDK Corporation
- Multilayer circuit board with embedded module30 Jul 2026US 2026/0223296 A1Avary Holding (Shenzhen) Co., Limited.
- Component Carrier With Reinforcing Portion, and Manufacturing Method16 Jul 2026US 2026/0206142 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Offset-chip embedded circuit board and manufacturing method therefor11 Jun 2026US 2026/0165169 A1ZF Friedrichshafen AG
Most cited
By later US patents
- Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device73US 7,834,464 B2Infineon Technologies AG · 2010
- Embedding thin chips in polymer53US 9,171,794 B2MC10, Inc. · 2015
- Radio frequency identification device and method48US 6,867,983 B2Avery Dennison Corporation · 2005
- Method for embedding a component in a base48US 7,294,529 B2Imbera Electronics Oy · 2007
- Methods of producing printed circuit boards43US 4,912,844 ADimensional Circuits Corporation · 1990