Method for embedding a component in a printed circuit board

A method of manufacturing a printed circuit board or a printed circuit board intermediate product, the method comprising steps of:

• providing a combination of layers having a first and second outer surface, wherein the combination of layers comprises at least one insulating layer and at least one first metal layer, wherein the at least one first metal layer is disposed on and runs parallel to the at least one insulating layer and forms at least one of the first and second outer surfaces of the combination of layers;
• embedding a component in a clearance passing through all the layers comprised in the combination of layers, the component having at least one first contact pad in the combination of layers such that the at least one first contact pad intersects the first horizontal plane of the at least one first metal layer;
• arranging a first further metal layer which directly connects the at least one first contact pad to the at least one first metal layer without interposing any insulating layer between the at least one first metal layer and the first further metal layer;
• wherein the at least one first metal layer and the first further metal layer form a combined metal layer structure comprising a thinned portion in an area adjacent to the clearance,
• wherein the thinned portion bridges the at least one first contact pad and the at least one first metal layer;
• and
• wherein the combination of layers comprises at least one layer made of curable prepreg material;
• wherein the component is embedded in the clearance by a resin from the at least one layer made of curable prepreg material, wherein the same resin contacts a lower surface of the first metal layer, a lower surface of the first further metal layer, and a sidewall of the component.