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US 7,834,464 B2Granted
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
AssigneeInfineon Technologies AG
InventorsThorsten Meyer, Markus Brunnbauer, Jens Pohl
Life of this patent
Estimating the term…
Abstract
A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.
Claims10
A semiconductor chip package, comprising:
- a spatially homogeneous material layer comprising a first surface and a second surface opposite to the first surface;
- a first semiconductor chip covered by the spatially homogeneous material layer, wherein a first surface of the first semiconductor chip is coplanar with the first surface of the spatially homogenous material layer;
- a second semiconductor chip covered by the spatially homogenous material layer, wherein a first surface of the second semiconductor chip is coplanar with the second surface of the spatially homogenous material layer;
- and
- electrical via formed through the spatially homogenous material layer between the first and second surfaces.
2 more elements
A semiconductor chip package, comprising:
- a spatially homogeneous material layer;
- a first semiconductor chip covered by the spatially homogenous material layer and comprising at least one first contact pad proximate to a first side of the spatially homogeneous material layer;
- a second semiconductor chip covered by the spatially homogeneous material layer and comprising at least one second contact pad proximate to a second side of the spatially homogeneous material layer;
- electrical via connections formed through the spatially homogeneous material layer;
- and
- contact elements provided on one of the first and second sides of the spatially homogeneous material layer and connected with selected ones of the first or second contact pads, respectively, including by the via connections.
3 more elements
Dependencies are inferred from the claim text.