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US 6,867,983 B2Granted
Radio frequency identification device and method
AssigneeAvery Dennison Corporation
InventorsPeikang Liu, Scott Wayne Ferguson, Dave N. Edwards, Yukihiko Sasaki
Life of this patent
Estimating the term…
Abstract
A device, such as a radio frequency identification (RFID) inlay structure for an RFID tag or label, includes a microstructure element, with leads coupling the microstructure element to other electrical or electronic components of the device. The leads may be electroless-plated leads, and may contact connectors of the microstructure element without the need for an intervening planarization layer.
Claims74
A method for producing an electronic device, comprising:
- forming leads directly in contact with a substrate;
- and
- coupling the leads to connectors of a microstructure element;
- wherein the forming and the coupling are parts of a direct metallizing of the leads in contact with the connectors;
- wherein the direct metallizing includes electroless plating of the leads;
- and
- wherein the electroless plating includes:
- depositing a catalyst on the substrate;
- activating the catalyst;
- and
- bringing the catalyst into contact with a plating solution, to thereby form the leads.
8 more elements
A method for producing an electronic device, comprising:
- forming leads directly in contact with a substrate;
- and
- coupling the leads to connectors of a microstructure element;
- wherein the forming and the coupling are parts of a direct metallizing of the leads in contact with the connectors;
- wherein a gap exists between the microstructure element and side walls of the recess;
- wherein the forming includes forming the leads over the gap;
- wherein the direct metallizing includes electroless plating of the leads;
- wherein the electroless plating includes:
- depositing a catalyst on the substrate;
- activating the catalyst;
- and
- bringing the catalyst into contact with a plating solution, to thereby form the leads;
- and
- wherein the depositing includes depositing the catalyst at least partially into the gap.
11 more elements
A method for producing an electronic device, comprising:
- forming leads directly in contact with a substrate;
- and
- coupling the leads to connectors of a microstructure element;
- wherein the forming and the coupling are parts of a direct metallizing of the leads in contact with the connectors;
- wherein a gap exists between the microstructure element and side walls of the recess;
- wherein the forming includes forming the leads over the gap;
- wherein the direct metallizing includes electroless plating of the leads;
- and
- wherein the electroless plating includes:
- depositing a catalyst on the substrate;
- activating the catalyst;
- and
- bringing the catalyst into contact with a plating solution, to thereby form the leads;
- and
- further comprising, prior to the depositing the catalyst, depositing a dielectric material into the gap.
12 more elements
A method for producing an electronic device, comprising:
- forming leads directly in contact with a substrate;
- coupling the leads to connectors of a microstructure element;
- and
- forming a strip across the microstructure element to retain the microstructure element in the recess
- wherein the forming the leads and the coupling are parts of a direct metallizing of the leads in contact with the connectors;
- wherein a gap exists between the microstructure element and side walls of the recess;
- wherein the forming the leads includes forming the leads over the gap;
- wherein the direct metallizing includes electroless plating of the leads;
- and
- wherein the electroless plating includes:
- depositing a catalyst on the substrate;
- activating the catalyst;
- and
- bringing the catalyst into contact with a plating solution, to thereby form the leads.
11 more elements
A method for producing an electronic device, comprising:
- forming leads directly in contact with a strap substrate;
- coupling the leads to connectors of a microstructure element;
- and
- operatively coupling the leads with an antenna of the device;
- wherein the strap substrate, the microstructure element, and the leads are all part of a strap;
- wherein the operatively coupling includes placing the strap in contact with the antenna;
- wherein the forming and the coupling are parts of a direct metallizing of the leads in contact with the connectors;
- and
- wherein the antenna and the leads are formed as a unitary single structure on the substrate, by direct metallization.
6 more elements
A method for producing an electronic device, comprising:
- forming leads directly in contact with a substrate, wherein the substrate is a lead substrate;
- and wherein the lead substrate and the leads are part of a lead web;
- coupling the leads to connectors of a microstructure element;
- wherein the microstructure element is part of a microstructure web that includes a microreplicated substrate into which the microstructure element is placed;
- and
- following the coupling, separating the microstructure element from the microstructure web.
3 more elements
A method for producing an electronic device, comprising:
- forming leads directly in contact with a lead substrate;
- and
- coupling the leads to connectors of a microstructure element;
- prior to the coupling, placing the microstructure element in a recess in the microreplicated substrate;
- and
- prior to the placing, coating the recess with a release layer;
- wherein the lead substrate and the leads are part of a lead web;
- wherein the microstructure element is part of a microstructure web that includes a microreplicated substrate into which the microstructure element is placed;
- and
- wherein the coupling includes laminating the webs together.
7 more elements
A method for producing an electronic device, comprising:
- forming leads directly in contact with a lead substrate;
- coupling the leads to connectors of a microstructure element, wherein the microstructure element is part of a microstructure web that includes a microreplicated substrate into which the microstructure element is placed;
- and
- following the coupling, separating the microreplicated substrate from the microstructure element;
- wherein the lead substrate and the leads are part of a lead web;
- wherein the coupling includes laminating the webs together;
- and
- wherein the coupling includes securing the microstructure element to the leads.
5 more elements
A method for producing an electronic device, comprising:
- forming leads directly in contact with a substrate;
- coupling the leads to connectors of a microstructure element that is in a recess in the substrate;
- and
- forming a strip across the microstructure element to retain the microstructure element in the recess;
- wherein the leads are directly deposited on the substrate;
- wherein the forming and the coupling are parts of a direct metallizing of the leads in contact with the connectors;
- and
- wherein the direct metallizing includes electroless plating of the leads.
5 more elements
A method for producing an electronic device, comprising:
- placing a microstructure element in a recess in a substrate;
- forming leads directly in contact with the substrate;
- coupling the leads to connectors of the microstructure element;
- and
- forming a strip across the microstructure element to retain the microstructure element in the recess;
- wherein the forming and the coupling are parts of a direct metallizing of the leads in contact with the connectors;
- wherein the direct metallizing includes electroless plating of the leads;
- wherein a gap exists between the microstructure element and side walls of the recess;
- and
- wherein the forming includes forming the leads over the gap.
7 more elements
A method for producing an electronic device, comprising:
- forming leads directly in contact with a substrate;
- and
- coupling the leads to connectors of a microstructure;
- wherein the forming and the coupling are parts of a direct metallizing of the leads in contact with the connectors;
- wherein the forming and the coupling also include forming an antenna and coupling the leads to the antenna;
- and
- wherein the direct metallizing includes plating to form the leads and the antenna.
4 more elements
Dependencies are inferred from the claim text.