H05K 2203/0562
Details of resist
H05K2203/0562 (Details of resist) appears on 959 US grants and 864 published applications in this corpus.
Search patents in H05K- Granted patents
- 959
- Published applications
- 864
- Assignees
- 423
- Inventors
- 2,268
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 1 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 9 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 7 | 0 |
| 1985 | 10 | 0 |
| 1986 | 9 | 0 |
| 1987 | 11 | 0 |
| 1988 | 20 | 0 |
| 1989 | 15 | 0 |
| 1990 | 9 | 0 |
| 1991 | 18 | 0 |
| 1992 | 14 | 0 |
| 1993 | 17 | 0 |
| 1994 | 23 | 0 |
| 1995 | 32 | 0 |
| 1996 | 25 | 0 |
| 1997 | 12 | 0 |
| 1998 | 20 | 0 |
| 1999 | 19 | 0 |
| 2000 | 15 | 0 |
| 2001 | 24 | 8 |
| 2002 | 22 | 26 |
| 2003 | 26 | 39 |
| 2004 | 30 | 51 |
| 2005 | 33 | 48 |
| 2006 | 24 | 72 |
| 2007 | 33 | 80 |
| 2008 | 37 | 67 |
| 2009 | 36 | 63 |
| 2010 | 34 | 39 |
| 2011 | 40 | 34 |
| 2012 | 46 | 36 |
| 2013 | 27 | 18 |
| 2014 | 23 | 40 |
| 2015 | 19 | 40 |
| 2016 | 23 | 29 |
| 2017 | 36 | 31 |
| 2018 | 17 | 20 |
| 2019 | 23 | 15 |
| 2020 | 18 | 23 |
| 2021 | 16 | 16 |
| 2022 | 17 | 24 |
| 2023 | 14 | 16 |
| 2024 | 13 | 12 |
| 2025 | 12 | 11 |
| 2026 | 5 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/0568Resist used for applying paste, ink or powderIndexing code157
- H05K 2203/0577Double layer of resist having the same patternIndexing code156
- H05K 2203/0574Stacked resist layers used for different processesIndexing code121
- H05K 2203/0588Second resist used as pattern over first resistIndexing code113
- H05K 2203/0571Dual purpose resistIndexing code108
- H05K 2203/0597Resist applied over the edges or sides of conductorsIndexing code104
- H05K 2203/0582Coating by resist, i.e. resist used as mask for application of insulatingIndexing code92
- H05K 2203/0594Insulating resist or coating with special shaped edgesIndexing code89
All 12 subgroupsShow fewer
- H05K 2203/0565Resist used only for applying catalyst, not for plating itselfIndexing code44
- H05K 2203/0585Second resist used as mask for selective stripping of first resistIndexing code41
- H05K 2203/0591Organic non-polymeric coatingIndexing code38
- H05K 2203/058Additional resists used for the same purpose but in different areas, i.e.Indexing code29
Recent patents
- Flexible circuit board11 Aug 2026US 12,707,564 B2Chipbond Technology Corporation
- Circuit board and manufacturing method thereof4 Aug 2026US 12,701,654 B2Samsung Electro-Mechanics Co., Ltd.
- Component carrier and method of manufacturing the same7 Apr 2026US 12,598,696 B2AT&S (Chongqing) Company Limited
- Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same7 Apr 2026US 12,598,707 B2Tse Co., Ltd.
- Electronic device17 Feb 2026US 12,557,435 B2Innolux Corporation
- Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0190248 A1Resonac Corporation
- Electronic device21 May 2026US 2026/0143859 A1Innolux Corporation
- Method of forming a pattern for microelectronic devices7 May 2026US 2026/0129766 A1Oregon State University
- Hybrid mold, method for manufacturing hybrid mold, wiring structure, and method for manufacturing wiring structure30 Apr 2026US 2026/0122788 A1Panasonic Intellectual Property Management Co., Ltd.
- Protection circuit module, method of manufacturing same and secondary battery including same26 Mar 2026US 2026/0088606 A1Samsung SDI.Co., Ltd.
Most cited
By later US patents
- Selective plating method for forming integral via and wiring layers210US 5,209,817 AInternational Business Machines Corporation · 1993
- Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components193US 4,067,104 ARockwell International Corporation · 1978
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Printed wiring board and method for manufacturing the same157US 6,228,466 B1Ibiden Co., Ltd. · 2001