H05K 2203/0597
Resist applied over the edges or sides of conductors
Official title: Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
H05K2203/0597 (Resist applied over the edges or sides of conductors) appears on 104 US grants and 95 published applications in this corpus.
Search patents in H05K- Granted patents
- 104
- Published applications
- 95
- Assignees
- 77
- Inventors
- 219
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 3 | 4 |
| 2003 | 1 | 6 |
| 2004 | 7 | 5 |
| 2005 | 5 | 8 |
| 2006 | 4 | 8 |
| 2007 | 3 | 7 |
| 2008 | 6 | 5 |
| 2009 | 3 | 7 |
| 2010 | 2 | 3 |
| 2011 | 4 | 3 |
| 2012 | 7 | 3 |
| 2013 | 2 | 1 |
| 2014 | 3 | 3 |
| 2015 | 3 | 11 |
| 2016 | 3 | 0 |
| 2017 | 6 | 2 |
| 2018 | 3 | 2 |
| 2019 | 3 | 1 |
| 2020 | 0 | 5 |
| 2021 | 2 | 3 |
| 2022 | 4 | 2 |
| 2023 | 5 | 2 |
| 2024 | 0 | 1 |
| 2025 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Circuit board28 Oct 2025US 12,457,690 B2LG Innotek Co., Ltd.
- Circuit board7 Jan 2025US 12,193,152 B2LG Innotek Co., Ltd.
- Electrical device, interlayer ply including an electrical device and methods for making said electrical device and interlayer ply7 Nov 2023US 11,812,557 B2Pilkington Group Limited
- Method for manufacturing wiring board10 Oct 2023US 11,785,721 B2Toyota Jidosha Kabushiki Kaisha
- Wiring board and method for manufacturing wiring board3 Oct 2023US 11,778,737 B2Dai Nippon Printing Co.Ltd.
- Circuit board20 Mar 2025US 2025/0098059 A1LG Innotek Co., Ltd.
- Circuit board5 Sep 2024US 2024/0298412 A1AAC Microtech (Changzhou) Co., Ltd.
- Circuit board3 Aug 2023US 2023/0247769 A1LG Innotek Co., Ltd.
- Circuit board22 Jun 2023US 2023/0199944 A1LG Innotek Co., Ltd.
- Method for manufacturing wiring board25 Aug 2022US 2022/0272847 A1Toyota Jidosha Kabushiki Kaisha
Most cited
By later US patents
- Selective plating method for forming integral via and wiring layers210US 5,209,817 AInternational Business Machines Corporation · 1993
- Method for forming capped copper electrical interconnects65US 5,549,808 AInternational Business Machines Corporation · 1996
- Capped copper electrical interconnects51US 5,898,222 AInternational Business Machines Corporation · 1999
- Inter-layer connection structure, multilayer printed circuit board and production processes therefor47US 6,589,870 B1International Business Machines Corporation · 2003
- Printed-circuit board and method of manufacture thereof43US 6,809,415 B2Ibiden Co., Ltd. · 2004