H05K 2203/0594
Insulating resist or coating with special shaped edges
H05K2203/0594 (Insulating resist or coating with special shaped edges) appears on 89 US grants and 107 published applications in this corpus.
Search patents in H05K- Granted patents
- 89
- Published applications
- 107
- Assignees
- 72
- Inventors
- 246
- Latest grant
- 3 Sep 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 2 |
| 2002 | 3 | 2 |
| 2003 | 1 | 4 |
| 2004 | 4 | 6 |
| 2005 | 3 | 8 |
| 2006 | 4 | 9 |
| 2007 | 6 | 9 |
| 2008 | 3 | 7 |
| 2009 | 5 | 5 |
| 2010 | 3 | 3 |
| 2011 | 3 | 5 |
| 2012 | 4 | 5 |
| 2013 | 5 | 1 |
| 2014 | 4 | 10 |
| 2015 | 4 | 10 |
| 2016 | 4 | 2 |
| 2017 | 4 | 1 |
| 2018 | 1 | 1 |
| 2019 | 2 | 1 |
| 2020 | 2 | 5 |
| 2021 | 2 | 3 |
| 2022 | 3 | 4 |
| 2023 | 3 | 0 |
| 2024 | 2 | 2 |
| 2025 | 0 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Through-hole electrode substrate3 Sep 2024US 12,080,637 B2Dai Nippon Printing Co.Ltd.
- Wiring board and method for manufacturing wiring board27 Feb 2024US 11,916,285 B2Dai Nippon Printing Co.Ltd.
- Wiring board and method for manufacturing wiring board3 Oct 2023US 11,778,737 B2Dai Nippon Printing Co.Ltd.
- Wiring board and method for manufacturing wiring board21 Mar 2023US 11,612,054 B2Dai Nippon Printing Co.Ltd.
- Substrate bonding pad having a multi-surface trace interface31 Jan 2023US 11,569,155 B2Western Digital Technologies, Inc.
- Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0190248 A1Resonac Corporation
- Semiconductor package16 Oct 2025US 2025/0324519 A1LG Innotek Co., Ltd.
- Through-hole electrode substrate5 Dec 2024US 2024/0404934 A1Dai Nippon Printing Co.Ltd.
- Wiring circuit board29 Aug 2024US 2024/0292528 A1Nitto Denko Corporation
- Substrate Bonding Pad Having a Multi-Surface Trace Interface15 Dec 2022US 2022/0399258 A1Western Digital Technologies, Inc.
Most cited
By later US patents
- Printed wiring board and method for manufacturing the same157US 6,228,466 B1Ibiden Co., Ltd. · 2001
- Printed wiring board interconnection apparatus81US 4,298,237 ABell Telephone Laboratories, Incorporated · 1981
- Ball grid array package for enhanced stress tolerance65US 6,583,515 B1Texas Instruments Incorporated · 2003
- Heat-resistant synthetic fiber sheet48US 7,026,033 B2Teijin Techno Products Limited · 2006
- Molded circuit board for ribbon cable connector45US 4,871,319 AAMP Incorporated · 1989