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US 11,916,285 B2Granted
Wiring board and method for manufacturing wiring board
AssigneeDai Nippon Printing Co., Ltd.
InventorsKoichi Suzuki, Seiji Take, Daisuke Matsuura
Life of this patent
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Abstract
A wiring board (10) includes a substrate (11) that is transparent and a wiring pattern region (20) that is disposed on the substrate (11) and that includes a plurality of wiring lines (21, 22). The wiring pattern region (20) has a sheet resistance of less than or equal to 5 Ω/sq, and each wiring line (21, 22) has a maximum width of less than or equal to 3 μm when viewed at a viewing angle of 120°.
Claims12
A wiring board comprising:
- a substrate that is transparent;
- and
- a wiring pattern region that is disposed on the substrate and that includes a plurality of wiring lines,
- wherein the wiring pattern region has a sheet resistance of less than or equal to 5 Ω/sq, and
- wherein each wiring line has a maximum width of less than or equal to 3 μm when viewed at a viewing angle of 120°.
2 more elements
A method for manufacturing a wiring board, the method comprising:
- a step of preparing a substrate that is transparent;
- and
- a step of forming a wiring pattern region including a plurality of wiring lines on the substrate,
- wherein the wiring pattern region has a sheet resistance of less than or equal to 5 Ω/sq, and
- wherein each wiring line has a maximum width of less than or equal to 3 μm when viewed at a viewing angle of 120°.
2 more elements
Dependencies are inferred from the claim text.