Substrate bonding pad having a multi-surface trace interface

A substrate bonding pad, comprising:

• conducting means for electrically coupling a solder ball to a trace of the substrate, the conducting means having a first interface means for electrically connecting to the trace;
• and
• plating means covering a surface of the conducting means for protecting the conducting means from corrosion and/or providing strength to the conducting means, the plating means electrically coupling the solder ball to the conducting means, the plating means having protrusion means for directly contacting the trace, the protrusion means having a second interface means for electrically connecting to the trace separate and distinct from the first interface means,
• wherein the protrusion means having a width extending in a direction perpendicular to a longitudinal axis of the trace and which is less than a width of the trace, and wherein the protrusion means extend into one or more apertures defined by a solder mask means of the substrate.

A substrate, comprising:

• an insulating layer configured to provide electrical insulation between electrically conductive elements of the substrate;
• a signal trace coupled to a top surface of the insulating layer;
• a solder mask in direct contact with a top surface of the signal trace, the solder mask defining a solder mask opening;
• and
• a bonding pad positioned within the solder mask opening, the bonding pad configured to directly contact the signal trace within two or more interface surface areas, the two or more interface surface areas being separate and distinct from one another, the bonding pad comprising:
• a conductive pad having a first interface surface in contact with a signal trace of the substrate;
• and
• a plating layer having a bottom surface in direct contact with the conductive pad, and one or more protrusions extending toward the signal trace in a direction generally parallel to a longitudinal axis of the signal trace, the one or more protrusions having a width extending in a direction perpendicular to the longitudinal axis and which is less than a width of the signal trace, and wherein the one or more protrusions extend into one or more apertures defined by a solder mask of the substrate,
• wherein each of the one or more protrusions include two parallel sidewalls extending upwardly from the bottom surface of the plating layer, and a second interface surface contiguous with the bottom surface of the plating layer, the second interface surface being disposed over and in direct contact with a top surface of the signal trace.