Printed wiring board and method for manufacturing the same
AssigneeIbiden Co., Ltd.
InventorsKiyotaka Tsukada, Masaru Takada, Mitsuhiro Kondo, Hiroyuki Kobayashi
Life of this patent
Estimating the term…
Abstract
A printed wiring board which has a conductor circuit (12) on an insulating substrate (10) and a surface insulating layer (14) formed on the surface of the substrate (10) including the surface of the conductor circuit (12). Part of the conductor circuit (12) has an exposed conductor section (120) having an exposed surface, and a surface insulating layer (140) around the conductor section (120) forms a recessed section at the same level of the surface of the conductor section (120) or lower than the surface. It is preferable to form a black or white solder resist layer on the surface insulating layer.
Claims20
A printed wiring boards comprising:
- an insulating layer;
- a conductor circuit provided on the insulating layer;
- a surface insulating layer provided on surfaces of said insulating layer and said conductor circuit and formed of a solder resist layer or a glass cloth resin layer, wherein part of said conductor circuit has an exposed conductor section with an exposed surface;
- said surface insulating layer around said exposed conductor section forming a recessed section level having a height which is the same as or lower than said surface of said exposed conductor section and higher than said surface of said insulating layer, said surface insulating layer of said recessed section being in contact with sides of said exposed conductor section.
A method of manufacturing a printed wiring board comprising the steps of:
- forming a conductor circuit on an insulating layer;
- forming a surface insulating layer on said insulating layer and a surface of said conductor circuit;
- and
- irradiating said surface insulating layer with a laser beam to expose a part of said conductor circuit, thereby forming an exposed conductor section and setting said surface insulating layer around said conductor circuit lower than a surface of said exposed conductor section, thereby forming a recessed section.
A printed wiring board, comprising:
- an insulating substrate;
- a plurality of pads provided on a surface of the insulating substrate for connecting connection terminals;
- and
- a black solder resist layer covering said surface of said insulating substrate and peripheral edges of said pads.
A printed wiring board, comprising:
- an insulating substrate;
- a plurality of pads provided on a surface of the insulating substrate for connecting connection terminals;
- and
- a white solder resist layer covering said surface of said insulating substrate and peripheral edges of said pads, said white solder resist layer containing an inorganic filler including titanium oxide.
A printed wiring board, comprising:
- an insulating substrate having first and second surfaces;
- a plurality of pads provided on said first surface of the insulating substrate for connecting connection terminals;
- and
- a green solder resist layer covering said first surface of said insulating substrate and peripheral edges of said pads.
Dependencies are inferred from the claim text.