H05K 2203/0565
Resist used only for applying catalyst, not for plating itself
H05K2203/0565 (Resist used only for applying catalyst, not for plating itself) appears on 44 US grants and 40 published applications in this corpus.
Search patents in H05K- Granted patents
- 44
- Published applications
- 40
- Assignees
- 25
- Inventors
- 88
- Latest grant
- 27 Feb 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 7 |
| 2008 | 0 | 1 |
| 2009 | 3 | 5 |
| 2010 | 1 | 2 |
| 2011 | 3 | 4 |
| 2012 | 5 | 4 |
| 2013 | 0 | 1 |
| 2014 | 2 | 0 |
| 2015 | 3 | 3 |
| 2016 | 3 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 2 |
| 2019 | 1 | 2 |
| 2020 | 2 | 3 |
| 2021 | 1 | 0 |
| 2022 | 2 | 2 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor27 Feb 2024US 11,917,768 B2Richview Electronics Co., Ltd.
- Electroless metal-defined thin pad first level interconnects for lithographically defined vias15 Aug 2023US 11,728,258 B2Intel Corporation
- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor1 Mar 2022US 11,266,027 B2Richview Electronics Co., Ltd.
- Electroless metal-defined thin pad first level interconnects for lithographically defined vias22 Feb 2022US 11,257,745 B2Intel Corporation
- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor8 Jun 2021US 11,032,915 B2Richview Electronics Co., Ltd.
- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor12 May 2022US 2022/0151081 A1Richview Electronics Co., Ltd.
- Electroless metal-defined thin pad first level interconnects for lithographically defined vias17 Mar 2022US 2022/0084927 A1Intel Corporation
- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor29 Oct 2020US 2020/0344895 A1Richview Electronics Co., Ltd.
- Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor15 Oct 2020US 2020/0329567 A1Richview Electronics Co., Ltd.
- Electroless metal-defined thin pad first level interconnects for lithographically defined vias13 Aug 2020US 2020/0258827 A1Intel Corporation
Most cited
By later US patents
- Electroless deposition employing laser-patterned masking layer90US 4,865,873 AGeneral Electric Company · 1989
- Method for manufacture of multilayer circuit board61US 4,902,610 AShipley Company, L.L.C. · 1990
- Method for manufacture of multilayer circuit board56US 5,246,817 AShipley Company, L.L.C. · 1993
- Methods of forming a patterned metal film on a support35US 4,388,351 AWestern Electric Company, Inc. · 1983
- Methods for manufacture of multilayer circuit boards29US 5,137,618 AFoster-Miller, Inc. · 1992