H05K 2203/0568
Resist used for applying paste, ink or powder
H05K2203/0568 (Resist used for applying paste, ink or powder) appears on 157 US grants and 156 published applications in this corpus.
Search patents in H05K- Granted patents
- 157
- Published applications
- 156
- Assignees
- 97
- Inventors
- 453
- Latest grant
- 22 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 10 | 0 |
| 1996 | 9 | 0 |
| 1997 | 2 | 0 |
| 1998 | 8 | 0 |
| 1999 | 1 | 0 |
| 2000 | 5 | 0 |
| 2001 | 5 | 1 |
| 2002 | 3 | 4 |
| 2003 | 7 | 10 |
| 2004 | 3 | 11 |
| 2005 | 10 | 8 |
| 2006 | 3 | 25 |
| 2007 | 7 | 26 |
| 2008 | 10 | 16 |
| 2009 | 10 | 13 |
| 2010 | 14 | 12 |
| 2011 | 6 | 6 |
| 2012 | 6 | 2 |
| 2013 | 3 | 1 |
| 2014 | 3 | 5 |
| 2015 | 2 | 1 |
| 2016 | 2 | 4 |
| 2017 | 4 | 3 |
| 2018 | 2 | 3 |
| 2019 | 2 | 1 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus and method for forming a resist fine pattern22 Jul 2025US 12,365,190 B2Unijet Co., Ltd.
- Attaching an SMD to an insulating layer with a solder joint in a cavity formed in an insulating layer23 Mar 2021US 10,959,338 B2Safran Electronics & Defense
- Conductive patterns and methods of using them29 Oct 2019US 10,462,908 B2Alpha Assembly Solutions Inc.
- Filling method of conductive paste and manufacturing method of multi-layer printed circuit board11 Jun 2019US 10,321,578 B2Nippon Mektron, Ltd.
- Manufacturing method of flexible printed wiring board4 Dec 2018US 10,149,392 B2Nippo Mektron, Ltd.
- Method of forming a pattern for microelectronic devices7 May 2026US 2026/0129766 A1Oregon State University
- Actinic radiation-curable inkjet resist ink, method for forming cured film, cured film, printed wiring board, and electronic device4 Dec 2025US 2025/0368843 A1Konica Minolta, Inc.
- Apparatus and method for forming a resist fine pattern15 Jun 2023US 2023/0182488 A1Unijet Co., Ltd.
- Attaching an smd to an insulating layer with a solder joint in a cavity formed in an insulating layer2 Jul 2020US 2020/0214142 A1Safran Electronics & Defense
- Method of fabricating strain-pressure complex sensor and sensor fabricated thereby23 May 2019US 2019/0159336 A1Electronics and Telecommunications Research Institute
Most cited
By later US patents
- Method of making high density solder bumps and a substrate socket for high density solder bumps149US 5,024,372 AMotorola, Inc. · 1991
- Method of bumping substrates by contained paste deposition146US 5,539,153 AHewlett-Packard Company · 1996
- Method of making subsurface electronic circuits121US 5,531,020 APoly-Flex Circuits, Inc. · 1996
- Composite solder paste for flip chip bumping102US 5,803,340 ADelco Electronics Corporation · 1998
- Electronic circuit device89US 5,684,677 AKabushiki Kaisha Toshiba · 1997