Manufacturing method of flexible printed wiring board
AssigneeNippo Mektron, Ltd.
InventorFumihiko Matsuda
Life of this patent
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Abstract
The manufacturing method of the flexible printed wiring board relating to an embodiment includes a step of preparing a metal foil clad laminate 1 including an insulating substrate 2 and metal foil 3 and metal foil 4 provided on main surfaces of the substrate 2, a step of forming a circuit pattern 5 by patterning the metal foil 3, a step of forming a peelable printing plate layer 6 on the substrate 2 so as to embed the pattern 5, a step of forming blind holes 7a and 7b where the pattern 5 is exposed inside by partially removing the printing plate layer 6, a step of printing conductive paste with the printing plate layer 6 as a printing mask, and filling the conductive paste 8 inside the blind holes, and a step of peeling off the printing plate layer 6 from the metal foil clad laminate 1.
Claims5
A manufacturing method of a flexible printed wiring board comprising:
- a step of preparing a metal foil clad laminate including an insulating substrate and metal foil provided on at least one of main surfaces of the insulating substrate;
- a step of forming a circuit pattern by patterning the metal foil;
- a step of forming a peelable printing plate layer on the insulating substrate so as to embed the circuit pattern;
- a step of forming a blind hole where the circuit pattern is exposed inside by partially removing the printing plate layer;
- a step of printing conductive paste with the printing plate layer as a printing mask, and filling the conductive paste inside the blind hole;
- and
- a step of peeling off the printing plate layer from the metal foil clad laminate;
- wherein the metal foil clad laminate is a double-sided metal foil clad laminate provided with first metal foil and second metal foil respectively on a front surface and a back surface of the insulating substrate, and the circuit pattern includes a conformal mask, and
- wherein, in the step of forming the blind hole, by irradiating the printing plate layer with a laser beam and partially removing the printing plate layer and the insulating substrate, a bottomed step via hole where the first metal foil is exposed in the middle and the second metal foil is exposed at a bottom surface is formed as the blind hole.
Dependencies are inferred from the claim text.