H05K 2203/0588
Second resist used as pattern over first resist
H05K2203/0588 (Second resist used as pattern over first resist) appears on 113 US grants and 111 published applications in this corpus.
Search patents in H05K- Granted patents
- 113
- Published applications
- 111
- Assignees
- 86
- Inventors
- 298
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 1 |
| 2002 | 6 | 4 |
| 2003 | 2 | 5 |
| 2004 | 3 | 3 |
| 2005 | 3 | 6 |
| 2006 | 0 | 3 |
| 2007 | 4 | 7 |
| 2008 | 4 | 11 |
| 2009 | 2 | 4 |
| 2010 | 1 | 2 |
| 2011 | 5 | 5 |
| 2012 | 4 | 6 |
| 2013 | 6 | 4 |
| 2014 | 4 | 5 |
| 2015 | 2 | 5 |
| 2016 | 6 | 10 |
| 2017 | 8 | 8 |
| 2018 | 3 | 2 |
| 2019 | 3 | 1 |
| 2020 | 2 | 2 |
| 2021 | 4 | 7 |
| 2022 | 5 | 6 |
| 2023 | 1 | 2 |
| 2024 | 4 | 1 |
| 2025 | 0 | 0 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method thereof4 Aug 2026US 12,701,654 B2Samsung Electro-Mechanics Co., Ltd.
- Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same7 Apr 2026US 12,598,707 B2Tse Co., Ltd.
- Printed circuit board and fabrication thereof13 Aug 2024US 12,063,739 B2Delphi Technologies IP Limited
- Printed circuit board and method for manufacturing the same25 Jun 2024US 12,022,621 B2Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board and method of manufacturing the same30 Jan 2024US 11,889,634 B2LG Innotek Co., Ltd.
- Protection circuit module, method of manufacturing same and secondary battery including same26 Mar 2026US 2026/0088606 A1Samsung SDI.Co., Ltd.
- Circuit board and manufacturing method thereof12 Sep 2024US 2024/0306292 A1Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board and method for manufacturing the same19 Oct 2023US 2023/0337367 A1Samsung Electro-Mechanics Co., Ltd.
- Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same11 May 2023US 2023/0147650 A1Tse Co., Ltd.
- Printed circuit board and fabrication thereof24 Nov 2022US 2022/0377889 A1Delphi Technologies IP Limited
Most cited
By later US patents
- Planar metal interconnection system and process34US 4,307,179 AInternational Business Machines Corporation · 1981
- Liquid crystal display device having a flexible circuit board31US 6,657,606 B2Samsung Electronics Co., Ltd. · 2003
- Circuit board for high pin count surface mount pin grid arrays29US 5,313,021 AAptix Corporation · 1994
- Circuit board for high pin count surface mount pin grid arrays28US 5,400,948 AAptix Corporation · 1995
- System-in-package structure28US 7,417,329 B2Advanced Semiconductor Engineering, Inc. · 2008