Printed circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMi Jeong JEON, Tae Hee YOO, Hyun Seok YANG, In Jae CHUNG
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Abstract
A method of manufacturing a printed circuit board includes: forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer; forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings; and removing the first and second resist films. The first and second openings have different widths in a cross-section.
Claims17
A method of manufacturing a printed circuit board, the method comprising:
- forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer;
- forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings;
- and
- removing the first and second resist films,
- wherein
- the first and second openings have different widths in a cross-section.
A printed circuit board comprising:
- an insulating layer;
- a seed metal layer disposed on the insulating layer;
- and
- a metal post including a first metal portion, disposed on the seed metal layer, and a second metal portion disposed on the first metal portion,
- wherein
- the first and second metal portions are integrated with each other without a boundary therebetween,
- the first and second metal portions have different widths in a cross-section, and
- the seed metal layer is in contact with the first metal layer, but is spaced apart from the second metal layer.
Dependencies are inferred from the claim text.